Software Engineering Intern, Connectivity - HP IQ

Description

The company's Connectivity Software team, part of HP IQ, builds foundational software for the next generation of connected experiences across devices and platforms.

The team works where systems software, wireless connectivity and emerging technologies meet, aiming for experiences that feel seamless and intelligent.

This internship puts you alongside experienced engineers writing on-device software for future HP IQ experiences, covering design, development and rollout across new devices and platforms. It is hands-on: you write code, tackle hard system-level problems and help build new experiences.

Responsibilities

• Write on-device firmware and system software in C, C++ or Python for connected devices.
• Build and improve software that supports wireless connectivity across different devices and platforms.
• Look into sensing, machine learning and AI methods for hard technical problems.
• Find and fix bugs across system software, wireless connectivity and application code.
• Work with hardware and software engineers to turn their requirements into technical solutions.
• Take part in code reviews and technical design discussions, learning from the team and adding your own input.
• Help test, validate and document software and firmware features.

Requirements

• Write efficient on-device firmware and system software in C, C++ or Python that implements Wi-Fi and Bluetooth protocols across several device types.
• Design and build device-to-device discovery and pairing protocols that work reliably in enterprise and consumer settings.
• Tune machine learning inference for resource-constrained devices, trading off model accuracy against power use and latency.
• Develop sensing algorithms that use data and AI to enable new ambient and wearable interactions.
• Debug and fix complex problems that span the wireless stack, operating system integration and application code.
• Work with hardware engineers, system software teams and product managers to turn requirements into technical solutions.
• Join code reviews and design discussions, learning from the team and contributing ideas to its technical direction.
• Help with testing, validation and documentation of connectivity features and firmware updates.
• Preferred: experience with edge machine learning or AI inference on embedded devices.
• Preferred: familiarity with IoT or ambient computing.
• Preferred: experience shipping consumer software products from development to production.
• Preferred: background in IoT, wearable or mobile device development.
• Preferred: exposure to agentic workflows or multi-device ecosystem design.

Conditions

Pay is $40.00 to $50.00 per hour. The final offer depends on skills, qualifications and experience.

The internship runs from May or June to August or September 2027, with final dates set around student schedules.

Full-time schedule in Administration, with no shift premium (United States of America).

The company does not list any travel or relocation requirements for this role.

The company is an equal opportunity employer.

Benefits

• Health, dental and vision insurance.
• Long-term and short-term disability insurance, life insurance and an employee assistance program.
• Flexible spending account.
• Paid parental leave of 4 to 12 weeks, depending on tenure.
• 11 paid holidays.
• Flexible paid vacation and sick leave.
• Details are in the US benefits overview.