Principal Firmware Developer, HBM

Description

The company makes memory and storage products and is a leading player in the semiconductor industry.

You will join the HBM Architecture team to build and ship firmware and embedded software for next-generation custom High Bandwidth Memory (HBM) products.

The role carries technical leadership: you review firmware requirements, guide how they get implemented, and help with validation.

You will work with firmware architects, chip design and verification groups, and customers to deliver firmware that is reliable, scales well, and performs strongly.

Responsibilities

• Study firmware architecture, design requirements and customer requirements, then turn them into implementation plans.
• Build firmware for next-generation SoC designs, covering driver layers, design verification firmware, manufacturing and test firmware, and production firmware.
• Use FPGA prototyping to build and check firmware.
• Work with HBM architecture, design and verification teams to tune firmware, RTL, hardware features and IP choices together, keeping interfaces clean and designs future-proof.
• Lead technical work from early concept and architecture exploration through silicon bring-up, qualification, customer enablement and ongoing product support.
• Lead technical discussions with internal and external parties to settle key requirements and features.
• Help drive new ideas for the next memory generation in a changing work environment.
• Use GenAI to build AI-assisted development workflows.

Requirements

• Background in embedded systems or firmware development, including low-level programming and system control.
• Track record architecting complex firmware, interfaces and system-level enablement features for GPUs, CPUs and TPUs in large AI datacenter environments.
• Experience with memory technologies such as DRAM, HBM, NAND or related subsystem architectures.
• Hands-on work with low-level firmware, hardware bring-up and silicon debug.
• Exposure to RAS, diagnostics, telemetry, testing or reliability-focused firmware.
• Familiarity with high-speed interfaces and protocols, such as memory controllers, PHY interaction or SoC-level firmware integration.
• Experience working in multi-disciplinary silicon development teams across hardware, firmware and architecture groups.
• Understanding of DRAM operation and JEDEC standards, preferably HBM, plus exposure to AI/ML workloads or datacenter-scale memory systems and strong communication skills.
• Proficiency with AI and AI-enabled development workflows.
• BSEE or higher and 10+ years of engineering or design engineering experience.

Conditions

Job title and level depend on your experience and qualifications.

The US base salary range the company estimates for this full-time role is $181,000.00 to $308,000.00 a year.

Pay within the range depends on role, level and location, plus knowledge, skills, experience, tenure and relevant education, and the range may change with business needs.

A recruiter can share the range for your preferred location during hiring.

The posted US figures cover base salary only, excluding bonus, equity and benefits.

The posting includes a link with information on your right to work.

The company prohibits child labour, follows applicable labour laws and charges candidates no recruitment fees.

Benefits

• Additional compensation may include bonuses and equity.
• A choice of medical, dental and vision plans in all locations, so you can pick what fits your family and budget.
• Income protection if illness or injury keeps you from working, and paid family leave.
• A paid time-off program and paid holidays.
• The full details are in the benefits guide on the company's careers site.