Field Applications Engineer (FAE) Intern - Summer 2027

Description

The company is a semiconductor firm bringing together secure edge intelligence, advanced chip solutions and system expertise for customers in vehicles, factories, hospitals, homes and connected devices.

The Global Sales and Applications group works with customers to match technical solutions to application needs, resolve integration problems and speed up design wins.

This is a 12 week paid summer internship for rising juniors, seniors and graduate students, placed within the Field Application Engineering group with an experienced FAE mentor and real technical work from the first day.

The internship is a main route into the company's Technical Sales and Applications Program (TSAP), an early-career track for full-time technical sales and applications roles, and strong interns may receive a return offer after graduation.

Responsibilities

• Work with senior FAEs on customer projects that have real business impact, turning application requirements into practical solutions built on company products.
• Help choose suitable MCUs, MPUs, connectivity, analog, power management and edge processing parts for customer needs.
• Take part in customer meetings, design reviews, product evaluations, proofs of concept and solution demos.
• Help investigate customer issues, reproduce them, record findings and contribute to action plans and follow-up.
• Bring up evaluation boards and reference designs, set up SDKs and development environments, and add example software to prototypes.
• Write or change firmware and application code in C, C++, Python or similar languages under engineers' guidance.
• Help debug embedded software and integrate systems involving real-time control, sensor interfaces, connectivity, Linux or RTOS.
• Evaluate products and validate them in the lab, troubleshooting at system level with oscilloscopes, logic analyzers, multimeters, power supplies, probes, power analyzers and debug or trace tools.
• Help review schematics and PCBs, check interfaces, study power-up sequencing and signals, and investigate hardware and software integration issues.
• Write concise test plans, record measurements, organize results and explain conclusions to technical and non-technical audiences.
• Prepare customer-ready presentations, demos, quick-start guides, application notes and training material with senior engineer guidance.
• Gather customer feedback and work with sales, marketing, product management, product line and engineering teams to improve tools, software, documentation and support content.
• Present your summer project, including approach, results and recommendations, to sales and applications leaders in a final capstone presentation.

Requirements

• Be currently enrolled in a Bachelor's or Master's program in electrical engineering, computer engineering, computer science, mechatronics or a closely related technical field.
• Be a rising junior, rising senior or graduate student, with expected graduation between December 2027 and June 2029.
• Hold a cumulative GPA of at least 3.0 out of 4.0.
• Be authorized to work in the United States. No sponsorship is available for intern roles.
• Be available full-time for 12 weeks during summer 2027, May through August.
• Preferred: coursework or project work in embedded systems, analog and digital circuits, computer architecture, microcontrollers or processors, wireless communications, power electronics, control systems or semiconductor applications.
• Preferred: hands-on work with microcontrollers, MPUs, FPGAs, development boards, evaluation kits or reference designs. Familiarity with ARM-based systems is a plus.
• Preferred: programming in C, C++, Python or similar, with some exposure to IDEs, SDKs, version control, RTOS basics or embedded Linux.
• Preferred: familiarity with embedded interfaces such as UART, SPI, I2C, CAN, USB or Ethernet.
• Preferred: experience with lab equipment, schematic or PCB review, board bring-up, firmware debugging, sensor integration, motor control, edge AI or robotics, or a willingness to learn these.
• You are curious about how chips solve real system problems and enjoy learning by building and testing.
• You debug methodically: you form a hypothesis, measure the system, isolate variables and record the result.
• You communicate clearly with engineers, customers, sales staff and non-technical colleagues.
• You take initiative, own your work, collaborate well and adjust when priorities shift in a customer-focused setting.
• You want to build both technical depth and business understanding while contributing to team results.

Conditions

Full-time schedule for 12 weeks, May through August 2027.

Location to be discussed during the interview process.

Some local customer travel may be expected.

Applications are reviewed on a rolling basis, and early applications are encouraged because positions fill quickly.

The company is an equal opportunity and affirmative action employer and provides reasonable accommodations for qualified disabled individuals.

Benefits

• Competitive paid hourly pay.
• Dedicated FAE or TSE mentor and day-to-day manager support throughout the program.
• Hands-on experience across the semiconductor applications cycle, from requirements and technical evaluation to proof of concept and design-in support.
• Participation in intern cohort events, including professional development workshops, executive speaker sessions and cross-functional networking.
• Structured learning on the company's product portfolios, embedded systems, customer applications and the semiconductor industry.
• Possible relocation support or housing stipend, depending on location.
• Consideration for a full-time return offer into TSAP after graduation.