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Applied Materials

Application Engineer – Semiconductor 3D X-ray Solutions

  • Office
  • 3-6 years

Salary

$128,000/ year

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Description

The company makes materials science and engineering equipment that sits at the base of nearly every new semiconductor chip and advanced display worldwide.

Its equipment is used to support AI work and to bring next-generation chips to market faster.

You will join a group of scientists, engineers and research professionals working on 3D X-ray systems for semiconductor use.

Customers are chip manufacturing plants (fabs), failure analysis labs and advanced R&D groups building new device technology.

Responsibilities

  • Learn how customers' technologies work and where their critical gaps are, then stay on the work until the solution is in place.
  • Lead complex application projects and the team carrying them out.
  • Lead the teams running beta sites, evaluations and demos at customer premises, staying closely involved in the statement of work and the commitment schedule.
  • Discuss technical requirements and timelines with customers.
  • Define and approve product application support plans for installation.
  • Create and lead new methods that improve system performance for a specific application.
  • Analyze, develop and hand over new application capabilities within the system's scope, moving them from the product division to the customer application support team.
  • Lead technical review meetings with customers.
  • Run system demonstrations for fabs, failure analysis labs and R&D centers.
  • Develop new applications and methods for semiconductor devices, processes and packaging.
  • Give product development critical input by shaping system specifications from customer needs and application gaps.
  • Deliver advanced training on system operation, data acquisition and analysis workflows.
  • Design, build and tune reliable workflows for semiconductor inspection and analysis.
  • Characterize tools and run benchmarking and baseline performance studies for semiconductor use cases.
  • Act as the technical lead in customer-facing work: give strong technical presentations and demos, support industry conferences and trade shows, and write and present technical papers.
  • Serve as the technical link between engineering, sales and marketing and speak for the semiconductor customer.
  • Work with external clients and internal development teams to set best-in-class routine workflows, find new 3D X-ray uses across front-end and back-end processes, and solve high-value problems (HVPs) in yield, reliability, process development and advanced packaging.

Requirements

  • A BS or MS in a relevant technical field such as materials science, physics, electrical engineering or a related discipline.
  • 3-5 years of experience in a semiconductor-related field such as fabs, failure analysis, metrology or process development.
  • Hands-on experience designing experiments, analyzing data and delivering results in a commercial or customer-facing setting.
  • Willing and able to travel up to 30% of the time, domestically and internationally.
  • Practical depth in your own discipline and working knowledge of related fields.
  • Good grasp of best practices, how your area fits with others, and what sets competitors apart.
  • Able to guide less experienced colleagues and lead small, low-risk projects.
  • Able to solve complex problems from a fresh angle and make sound calls using several sources of information.
  • Able to influence customer, operational and project work across teams within broad guidelines.
  • Able to explain difficult or sensitive information and build consensus.
  • Preferred: background in microscopy or advanced imaging, such as X-ray CT, SEM or FIB.
  • Preferred: working knowledge of X-ray absorption and imaging or optical fundamentals.
  • Preferred: experience with semiconductor capital equipment in inspection, metrology or failure analysis workflows.
  • Preferred: familiarity with advanced semiconductor technologies such as 3D IC, heterogeneous integration and advanced packaging.

Conditions

Full-time, regular assignee role.

Travel is expected at 25% of the time.

Relocation assistance is available.

Based in Benicia, CA.

Base pay range is $128,000.00 to $176,000.00, set by location, hire grade, job knowledge, skills, experience and internal equity with the current team.

For sales roles, the posted range is Target Total Cash: base salary plus target bonus at 100% goal achievement.

Accommodation requests for the application process are handled by the company's HR team and cannot be used to ask about application status.

Benefits

  • A comprehensive benefits package.
  • Possible participation in a bonus program and a stock award program, where applicable.
  • Support for personal and professional growth, plus health and wellbeing programs covering work, home and beyond.

Where you’d work

From the office

About the company

Applied Materials

Office in United States

Also hiring in Austin, United States, Phoenix, United States, Eindhoven, Netherlands and 15 more places

2 of their 174 open roles are remote

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Details10 facts · Role, Location, Compensation, Employment
Type
Full-time
Equity
Equity offered
Specialty
Solutions Engineering
Region
United States
Pay period
Annual
Show 5 more factsShow less

Role

Category
Solutions & Support
Specialty
Solutions Engineering
Experience
5+ years

Location

Work model
Office
Region
United States
Office
  • United States

Compensation

Salary
$128,000 / year
Pay period
Annual
Equity
Equity offered

Employment

Type
Full-time

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