HW/SW System and Application Engineer Intern-Summer 2027

Description

The team works on a high frequency modem wireless interface, building evaluation and demonstration platforms for it.

This internship is a summer 2027 role within a hardware and software systems group focused on wireless products.

Responsibilities

• Write embedded firmware, FPGA logic, or both, for the evaluation and demo platforms of the wireless interface.
• Build Python tooling that automates testing, collects data, and runs analysis.
• Connect to evaluation boards and lab instruments to run work.
• Design test cases that exercise the wireless data link under a range of conditions.
• Help bring up hardware and debug it, and take part in system-level validation.
• Review collected data to find performance limits and behaviour that does not match expectations.
• Help build demonstrations of Wi-INT use cases.
• Write up the test setup, results, and recommendations.

Requirements

• Be enrolled in or working toward a B.S. or M.S. in computer systems engineering, electrical engineering, computer engineering, or a closely related field.
• Have experience with C/C++ and Python.
• Verilog or SystemVerilog and FPGA work are strongly preferred.
• Be familiar with embedded platforms.
• Have some experience with digital hardware design and testbench or simulation environments.
• Be comfortable with Git and Linux.
• PCB design and lab hardware debugging are a plus.
• Show solid hands-on troubleshooting and analytical ability.

Conditions

You must be returning to school or graduating at the end of the internship term to qualify for a summer internship.

If you graduate before July 2027, apply for entry-level full-time roles instead.

The company is an equal opportunity and affirmative action employer and provides reasonable accommodations to qualified disabled applicants.