Die-to-Die (D2D) Applications Engineer

Description

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Broadcom’s ASIC Product Division (APD) is focused on enabling customers to develop products with a sustainable and substantial competitive advantage. APD does this by delivering best-in-class technology platforms, easy-to-integrate bleeding-edge intellectual property, and by providing world-class customer support. APD’s customers span a wide range of industries developing ASICs for the largest and most complex cloud computing AI engines, supercomputers, networking, and advanced wireless solutions.

We are seeking a Die-to-Die (D2D) Applications Engineer to serve as the primary technical resource for internal and external customers integrating and deploying our proprietary D2D PHY IP in silicon. This role bridges hardware, firmware, and software, providing deep technical support across the full IP lifecycle — from RTL integration and simulation through silicon bring-up and production. You will develop expert-level knowledge of our D2D PHY architecture (hardware and software/firmware) and become the go-to engineer for solving complex, cross-domain integration and debug challenges.

While prior D2D PHY experience is a strong plus, we place equal or greater weight on candidates who are exceptional at root-causing hard problems that span RTL, firmware, and system-level interactions.

Responsibilities

• Provide hands-on technical support to internal and external customers integrating the D2D PHY IP into their ASIC and products
• Debug and resolve Verilog/RTL simulation issues encountered during customer integration
• Support internal DFT (Design-for-Test) and ATE (Automated Test Equipment) production test development teams with PHY-specific technical guidance
• Assist external customers with silicon bring-up, characterization, and production test/debug support
• Triage and resolve firmware-related issues and questions from customers using the PHY’s embedded software/firmware stack
• Diagnose issues that span multiple layers — RTL, firmware, and system/software — and identify root cause across hardware/software boundaries
• Develop and maintain deep expertise in the architecture, functionality, and operation of the proprietary D2D PHY (hardware and software)
• Create and improve internal documentation, debug guides, and application notes based on recurring customer issues
• Work cross-functionally with design, verification, firmware, product engineering, and DFT/test teams to escalate and close out issues
• Participate in customer-facing technical discussions, including simulation reviews, bring-up sessions, and post-silicon debug
• Required Qualifications:
• A Bachelor’s Degree in Electrical or Computer Engineering or equivalent, and 5+ years of related experience; or Masters degree and 3+ years of related experience
• Demonstrated hands-on experience running and debugging Verilog simulations
• Strong debugging skills across at least two of the following domains: RTL/digital logic, firmware, embedded software, or system-level hardware
• Comfort working at the intersection of hardware and software — able to trace an issue from a software/firmware symptom down to a hardware or RTL root cause (or vice versa)
• Solid understanding of digital design fundamentals and standard chip-level interfaces/protocols
• Strong communication skills, with the ability to explain complex technical issues clearly to both internal engineering teams and external customers
• Self-directed and comfortable owning ambiguous, open-ended debug problems
• Scripting skills (Python, Ruby, Tcl) for debug automation and log analysis
• Familiarity with embedded firmware development or debug (C/C++, register-level debug, on-chip debug tools)
• Preferred Qualifications:
• Direct experience with Die-to-Die (D2D) PHY IP, chiplet interconnects, or other high-speed SerDes/PHY IP
• Experience with silicon bring-up, lab debug equipment (oscilloscopes, logic analyzers, protocol analyzers), and characterization
• Experience supporting DFT and/or ATE test development (scan, BIST, test pattern debug)
• Prior experience in an applications engineering, field applications engineering (FAE), or customer-facing technical support role
• What Success Looks Like:
• Customers (internal and external) view you as a trusted, responsive technical resource for D2D PHY integration and debug
• Simulation and bring-up issues are triaged quickly and routed to root cause efficiently, whether the issue lives in RTL, firmware, or system integration
• Internal DFT/ATE teams get the PHY-specific support they need to develop robust test coverage
• Recurring issues are captured and turned into documentation that reduces future support burden

Benefits

• The annual base salary range for this position is USD 91,100.00 To USD 146,000.00
• As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.